The challenge of SIPs goes beyond what it takes to assemble them. Increasing functionality and performance in ICs have driven manufacturers to work with wider and more challenging packaging solutions.

The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...

We didn’t just take a sip. We took a good long drink of SIP technology in this round of iLabs testing. We gathered more than 50 devices from five SIP server vendors and 13 SIP endpoint vendors to ...