The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% during 2026–2032. PUNE, MAHARASHTRA, INDIA ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Micron Technology, Inc.’s MU recent revenue surge has been driven largely by a sharp rise in DRAM demand tied to artificial intelligence (AI) workloads. In the first quarter of fiscal 2026, MU’s DRAM ...

Intel's advanced chip node, 18A, is now in high-volume production at its new Arizona fab, but no major outside customers have emerged The fab is meant to help Intel catch back up to TSMC after years ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...

Rapidus Corp., a Tokyo-based chip manufacturing startup, reportedly plans to build a fab capable of making 1.4-nanometer processors. Nikkei Asia reported the initiative today. The fab could create ...

BEIJING, Nov 13 (Reuters) - Semiconductor Manufacturing International Corp 0981.HK, opens new tab ，China's largest contract chipmaker, reported on Thursday a 28.9% year-on-year increase in ...

ClickFix attacks have evolved to feature videos that guide victims through the self-infection process, a timer to pressure targets into taking risky actions, and automatic detection of the operating ...

Oct 22 (Reuters) - Lam Research (LRCX.O), opens new tab forecast second-quarter revenue above Wall Street estimates on Wednesday, as chipmakers ordered more of its equipment used to manufacture ...

Greetings, and welcome to the Axcelis and Veeco Merger Announcement Conference Call. [Operator Instructions]. Please note that this conference is being recorded. A copy of the investor presentation ...